Archive for June, 2008

NAND Market – Where’s Apple?

Monday, June 30th, 2008

So far in 2008, the NAND market has not experienced the “Apple effect” seen in previous years, despite the upcoming 3G iPhone (with up to 16GB of storage) and the SSD option for the MacBook Air.  Consumer confidence is low due to the repercussions of the US sub-prime mortgage crisis and consumer disposable income is [...]

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Rambus Asks for Ban on U.S. Sales of Hynix Chips

Friday, June 27th, 2008

The legal issues between Rambus and the DRAM manufacturers continues to move through the US court systems. Rambus won a patent infringement lawsuit three months ago against Hynix for the sale of Jedec-standard DRAM.  While Hynix is the first DRAM manufacturer to be addressed, Rambus is also pursuing patent infringement claims against most of the [...]

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Using Software to Speed up the Internet

Wednesday, June 25th, 2008

There is no such thing as too thin, too rich, too much horsepower or too much data transmission speed.  That is why semiconductor companies spend millions of dollars developing faster ICs, network processors and countless other ways of increasing transmission speed.  But, there might be a less expensive alternative.
 On June 23, 2008 NetExÒ, announced [...]

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RF Integration: Getting It All Together

Tuesday, June 24th, 2008

The holy grail in wireless ICs is a cost-effective one chip solution.  The challenge has been the integration of all digital and analog functions, including RF, on a single SoC.  To date, this has only been accomplished for relatively low-power, short-range networks.  As the range increases, the amount of transmission power required also increases, requiring [...]

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DDR3 and the Rambus Tipping Point

Wednesday, June 18th, 2008

An Amicus Brief was filed by three major OEMs this week in the ongoing legal activities between Rambus and the memory manufacturers.  What would concern these OEM about events that occurred almost 10 years ago?
Semico has neither the legal expertise nor the desire to comment on these ongoing cases.  However some aspects of the settlements [...]

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Feeding the Beast: Servers Consume High Density DRAM Modules

Monday, June 2nd, 2008

This report focuses on DRAM modules in the server segment and some of the memory packaging density that is achieved.  Servers drive the DRAM density and much of the packaging technology.  This is one segment where DRAM is not keeping up with monolithic density demand.  Packaging has become more important in the semiconductor industry as [...]

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