Archive for June, 2012

Legacy Fab Issues At The ConFab 2012

Thursday, June 21st, 2012

The ConFab 2012 highlighted sessions on the semiconductor industry’s blockbuster topics impacting advance technology manufacturing such as the transition to 450mm wafers and the increasing importance of 3D integration and advanced packaging. But this year the conference also allocated time to a discussion revolving around legacy manufacturing. Unlike finFETs and 450mm wafers, the [...]

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ADI Raises the Bar on Low Power Consumption for MEMS Accelerometers

Thursday, June 14th, 2012

Analog Devices has announced a MEMS accelerometer with the lowest power consumption, the ADXL362. The company cites the following levels as the lowest in the industry:

Measurement current: 2 µA
Wakeup mode: 300 µA
Sleep current: 10 nA

The innovation that ADI has achieved is the design of the control circuit for the accelerometer. More intelligence and [...]

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The Tablet PC Usage Model Continues to Evolve For the Next Generation

Tuesday, June 5th, 2012

About a week ago I had the pleasure of attending Phoenix ComicCon.  It is not as big a convention as ComicCon International in San Diego, but it keeps growing.  Frequent readers of the Semico Spin may remember I report on the consumer electronic trends I see at that show.
One of the big draws at Phoenix [...]

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OCP-IP

Friday, June 1st, 2012

We wanted to thank another one of our IMPACT sponsors – OCP-IP.
“OCP-IP is dedicated to proliferating a common standard for intellectual property (IP) core interfaces, or sockets, that facilitate “plug and play” System-on-Chip (SoC) design.”  Check out their website by clicking on their logo.

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