Legacy Fab Issues At The ConFab 2012
Thursday, June 21st, 2012
The ConFab 2012 highlighted sessions on the semiconductor industry’s blockbuster topics impacting advance technology manufacturing such as the transition to 450mm wafers and the increasing importance of 3D integration and advanced packaging. But this year the conference also allocated time to a discussion revolving around legacy manufacturing. Unlike finFETs and 450mm wafers, the [...]
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The ConFab 2012 highlighted sessions on the semiconductor industry’s blockbuster topics impacting advance technology manufacturing such as the transition to 450mm wafers and the increasing importance of 3D integration and advanced packaging. But this year the conference also allocated time to a discussion revolving around legacy manufacturing. Unlike finFETs and 450mm wafers, the [...]
Read full post...