Archive for the 'Manufacturing' Category

RF Integration: Getting It All Together

Tuesday, June 24th, 2008

The holy grail in wireless ICs is a cost-effective one chip solution.  The challenge has been the integration of all digital and analog functions, including RF, on a single SoC.  To date, this has only been accomplished for relatively low-power, short-range networks.  As the range increases, the amount of transmission power required also increases, requiring [...]

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DDR3 and the Rambus Tipping Point

Wednesday, June 18th, 2008

An Amicus Brief was filed by three major OEMs this week in the ongoing legal activities between Rambus and the memory manufacturers.  What would concern these OEM about events that occurred almost 10 years ago?
Semico has neither the legal expertise nor the desire to comment on these ongoing cases.  However some aspects of the settlements [...]

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Still Good Advice: Don’t Put All Your Fabs in One Basket

Friday, February 16th, 2007

Last week, NEC Electronics America held an open house to showcase their newly expanded and upgraded fab in Roseville, CA. The fab has added an 8-inch line to the already existing 6-inch facility. This is all part of NEC Electronics Multifab™ strategy which was unveiled in February 2006. The Multifab strategy is designed to [...]

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The Foundry Market Shows Its Maturity

Friday, November 3rd, 2006

Third quarter results have been posted and the fourth quarter is set. There are even some indications regarding the outcome for first quarter 2007 performance. Dedicated foundries have always provided a window to the next quarter performance through their visibility of orders and business activity.
Chartered, TSMC and UMC all expect a slower fourth quarter. [...]

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