Reporting from ComicCon 2010

Last week Semico’s Tony Massimini escaped the scorching 110° F (43°C) Phoenix temperatures and combined a work/vacation by attending ComicCon 2010 in San Diego, CA. He brought back five great video clips covering Intel and nVidia as well as his views on things to come. See all five videos at the links below. Tony, where’s your Klingon costume? OK, that’s last century. How about an Avatar outfit?

Introduction                                        http://www.twitvid.com/TVZFS
Demo of Intel’s SmartTV                 http://www.twitvid.com/YQQAQ
nVidio demo of 3D graphics          http://www.twitvid.com/YKK23
ComiCon overview                            http://www.twitvid.com/DU3GQ
Tony’s opinions and wrap-up       http://www.youtube.com/watch?v=gxJ8FMU87w0


July 28th, 2010 | Posted in General by Joanne Itow| - No Comments »

Apple Faces Flaws, Makes Fixes

There was a time when nothing was hipper than Apple—it had colors when others were grappling with grayscale,  a sense of style that was way out front, and mice when the rest of the world was stuck on “chicklet keyboards”—but gradually computing shifted. Due to wide adoption of the PCI bus family, the PC industry emerged from its chaotic swamp of standards and got traction.

Then, smaller got better. The form factor of choice moved from the desk to the backpack. Computing in the park became a feasible release from deskbound postures and fluorescent lighting. Apple was there.

And then wireless got big. PC users could untie themselves from network vines (and the attendant costs of endless cabling and switchgear). Again, Apple was in the lead, showing the world that the words “stylish” and “laptop,” and “airport” could go together well.  

At length, the backpacks turned into pockets. Computing entered the cellular age. Apple showed the world just how smart phones should look and feel.

But now the open source software world has finally gotten it.  With Android we’re now seeing HTC leading the pack with the 4G EVO on Sprint.  Samsung’s Galaxy S is making strong headway in the Asia Pac regions, and even Motorola is joining in on the Android bandwagon with the Droid X, a 4:3 ratio cell phone catering to movie buffs.  These phones have all hit the market at the same time as Apple’s iPhone 4, and have many features the iPhone lacks.  Form and function have finally collided. 

Where once, Apple could enforce cool—being uber-stylish was enough to drive sales to the part of the population that demanded to be different—the pressure of being out front technically and looking good may finally have broken some branches. 

The most recent eyebrow-raiser involved the antenna on the iPhone 4. Apparently, after inspiring a vortex of videos and a cacophony of charges and rebuttals, the public has determined that the darn thing shorts out if you hold the phone the wrong way. (There was also some concern about just who should pick up the iPhone in bars.) And then there was a software dust up—signal strength apparently isn’t what it used to be, if you go by the meter.

Although still close to our hearts, a lot of Apple value may be moving toward the surface. Originally, Apple led by innovative design, inside and out. But gradually the company seems to have emphasized form over substance. Apple today uses similar hardware and similar software to most everyone else and plenty of folks are now learning that form contributes to function.

Apple has always had a healthy sense of self esteem, but some critics have begun to call this hubris. If unchangeable batteries died (iPod), users were encouraged to upgrade to a model with more memory. If a first release was missing functionality, hotfixes appeared as exciting upgrades. It all appears to have tumbled down, however, when iPhone 4 antennas were suspected of shorting out because customers sometimes held their phones the “wrong way.”

So there was a moment of truth.  The company looked inward, stepped up, did a clear-voiced mea culpa, and made things right.   A $30 dollar drop-protection case (called by some a “blunt klutz trauma preventer”), now ships free of charge with each new iPhone.

It was a smart move. Considering that the tiny platform has computing power that just yesterday required locked doors and air conditioning, and realizing that the Lilliputian handset includes three versions of wireless, a protective cover may be the least it deserves. And besides, some estimates of the cost of a product recall went as high as $2 billion.

Ask any twenty-something, cell phones are lifelines. When one needs a phone the most, it is not the time to hold the fingers a special way. But now, crisis averted. Apple can go forward. I wonder what they’ll think of next.

Rick Lehtinen, Consultant


July 19th, 2010 | Posted in General by Michell Prunty| - 1 Comment »

SemiconWest 2010

The weather in San Francisco was beautiful and SemiconWest was a great show this year. In addition to the many new product and technology announcements, most exhibiters are well into a healthy recovery and optimistic about the next 12-18 months.
Here are just a few of our key takeaways.

 TSV and 3D packaging were the buzzwords of the week. TSV was mentioned in everyone’s promotional campaign. AMAT rolled out a suite of six tools targeted at TSV. Novellus tool enhancements targeted wafer level packaging for 3D integration. ESI announced a laser-based ultra-thin wafer dicing system primarily targeted at stacked memory but also applicable for stacked logic and memory and TSV interconnect applications.
 GlobalFoundries went on record. They will have a production EUV tool installed in Fab 8 (Malta) by 2H 2012, with production plans targeted for 2015.
 IMEC rolled out six announcements covering SiGe MEMS, narrow pitch interconnects, more efficient thin-film solar cells, an EUV mask cleaning program, and a new optical lithography illumination system to extend the life of immersion through 22nm. The jointly developed IMEC/ASML freeform illumination process uses micro-mirrors providing improved pattern quality over traditional illumination. And last but not least, Micron, AMAT and Ultratech have joined IMEC in their GaN-on-Silicon program.
 Soitec was upbeat because there’s a growing list of vendors starting to work with SOI. The infrastructure to support the growth is in place and ultra-thin (fully depleted) wafers will be ready for 22nm production. These wafers boast a buried oxide layer as thin as 10nm.
 Exponential sales growth for products that use mature technologies such as MEMS and LED are giving new life to the secondary equipment market. Companies such as Macquarie, KLA, AG Semiconductor and others are finding ways to capitalize on this growth. There was even a section in the South Hall dedicated to secondary equipment suppliers. There are many questions as to the real size of this market since equipment can change hands several times before it finds a new home. SEMI and Semico announced the launch of a joint study to quantify the secondary equipment market.

We were so busy at the SemiconWest booths, we only spent about 1 hour at Intersolar on Thursday. BP Solar exhibited last year but was noticeably missing this year. I was using their giveaway bag from last year for my groceries but finally threw it out after getting so many negative comments from the BP logo.

It would be nice if all SemiconWest exhibits could be so positive. If we could just remember that a cycle means we’ll eventually come around.

Jim Feldhan
President
and
Joanne Itow
Managing Director


July 19th, 2010 | Posted in General by Joanne Itow| - No Comments »

Decisions, Decisions, Decisions…

Fifteen years ago fabless companies flourished because production became somewhat routine and foundries could provide more than adequate manufacturing capacity. Many IDMs also realized they no longer needed to invest in internally developed, proprietary technology. Marketing and product development was the way to gain market share. After reviewing the technology announcements and presentations from DAC and the VLSI Symposium over the past two weeks it hit me. Manufacturing is once again becoming a differentiator.

The ITRS (International Technology Roadmap for Semiconductors) has outlined a transition path for us that was adopted by a majority of manufacturers. Most advanced logic products use copper, and now high-k, metal gate. A majority of companies with advanced manufacturing capabilities have moved to immersion lithography. Many processes and materials had a way of becoming accepted as standard.

Moving into the next generation process technology, semiconductor manufacturers, both fabless and IDM, have to make a number of significant manufacturing decisions which could impact their product’s market applications and the ability to deliver timely, future products. The semiconductor manufacturing decision involves more than just a process node or cost of ownership. Manufacturing technology is becoming a major decision point with numerous options.

Two years ago TSMC came out with their 40nm node. What used to be a half node is now a sweet spot. Now we have fully developed processes at 45nm, 40nm, 32nm, soon 28nm and 22nm.
Which node do you use for your next design? Companies are even skipping a generation altogether. For their high performance product lines, Freescale went from 90nm directly to 45nm/40nm.

At 32nm/28nm do you go with gate-first or gate-last? Samsung claimed bragging rights as the first foundry with a qualified 32nm gate-first process. Proponents of gate-first believe it’s a simpler solution. Intel and TSMC are using gate-last or replacement metal gate. Intel started production on their 32nm replacement metal gate process last year. Proponents of gate-last plan on using the technology for future generations and believe that gate-first is a “one hit wonder”, good for only one generation.

Admittedly there has always been a difference between the SOI wafer proponents and the non-SOI users. The anti-SOI wafer camp continues to search for ways to avoid the use of SOI wafers. At the VLSI Symposium in June, Intel presented an update on their floating body cell technology. Their solution requires several steps to add an insulative BOX, only where necessary, hence the term localized SOI. Intel claims the result is a customized ultrathin SOI providing optimized back-gate and body doping. Why go through these extra steps instead of using an SOI wafer? Currently IBM’s R&D SOI process requires a step to thin existing SOI wafers. But SOITEC’s roadmap does include a 10-20nm ultrathin wafer expected to be available for 22nm production and beyond.

Certainly, there is always more than one way to solve a problem. But can the industry afford to run so many different processes? Will we find that one process truly is better than the other? Two years ago I didn’t think it was feasible for TSMC to buck the trend with their 40nm process. Nonetheless, they are a leader and when they rolled out 40nm, other foundries felt they had to follow.

Semiconductor manufacturers have encountered many decision points when it comes to technology options. In the past, companies would eventually converge onto similar paths in terms of materials and processes because the best solution had a way of rising to the top. At a time when the industry is under pressure to reduce costs and time-to-market we seem to be driving ourselves to more complex and diverse ways to reach the same goal. Choosing your foundry partner involves a lot more than just wafer price. Could the selection of a particular process technology actually make or break a product line? It appears we are following the advice of Yogi Berra: When you get to a fork in the road, take it.

Joanne Itow,
Managing Director


July 6th, 2010 | Posted in General, Manufacturing by Joanne Itow| - No Comments »

Solar Radiation, The Good And The Evil

Solar energy is typically viewed as a very positive resource. Not only does solar energy help produce our food, recently we’ve seen a boom in photovoltaic electrical systems because we’ve gotten much better at converting sunlight into electricity.
As we all know, the solar system operates in cycles. During the past decade the sun has been in a lower energy producing cycle which some described as the sun sleeping. It now appears that the sun is waking up and over the next few years will begin its next cycle. That means we will experience more sunspots and an increased amount of solar radiation. The solar cycles build slowly and one is currently under way. Experts expect solar radiation will peak in 2011 and 2012.
That’s good news for people who have solar panels but it may wreak havoc on our high tech, mobile device society that we enjoy today. Solar storms can have a big effect and most are not positive outcomes. During a solar storm, if a plane flies over the poles, space radiation can cause radio blackouts, navigation errors and computers to reboot. Solar storms can also disable satellites that we use for weather forecasting, GPS navigation and communications. Radio bursts from solar flares can directly interfere with cell phone reception and the coronal mass ejections (CME) can cause electrical outages. In 1989 a CME caused an outage in Québec that lasted for six days.
While much of the intensity from solar activity is not expected to peak until 2011 and 2012 there isn’t much we can do to prevent the negative impact or prepare for it. Solar forecasting is becoming increasingly important as our connected world has gone digitally wireless and broadband. CME ejections take 2 to 5 days to reach earth. Satellites can be placed in sleep mode to protect it from damage but will result in a big disruption to businesses and consumers. What does this mean to the semiconductor industry? We may experience increase demand for replacement parts for normally healthy equipment such as cell phones or notebooks that have burned out or been damaged from intense solar activity.
Just be ready for a few interruptions.
Jim Feldhan, President


July 5th, 2010 | Posted in General by Joanne Itow| - No Comments »

Freescale Kinetis Family Connects with ARM MCUs

June 28, 2010

Last week at the Freescale Technology Forum (FTF) in Orlando, FL, Freescale announced a new MCU product line, Kinetis, based on the ARM Cortex M4 core. Kinetis is scalable low-power and mixed signal design. Freescale is expected to introduce seven new Kinetis MCU families over the course of the next 12 months. There will be over 200 pin, peripheral and software compatible devices.

Freescale integrates mixed signal capabilities in Kinetis in order to target consumer and industrial applications. ARM had developed the Cortex M3 for MCUs. The Cortex M4 was announced by ARM in February 2010. Freescale is a lead partner in the development of the M4. In April 2010, NXP announced future MCUs based on the Cortex M4. Freescale will sample Kinetis in 3Q 2010 with production in 1H 2011.

The Cortex M4 is an extension of the M3. The M4 includes DSP functionality. The Kinetis software will be backwards compatible with M3. Therefore, Freescale decided to jump into ARM MCUs with the M4 rather than put resources into an M3 version.

Semico Spin

My immediate reaction to the Kinetis announcement was, “Well, it’s about time!” I wondered what was taking so long. Freescale has been a long time partner with ARM, going back to its days as Motorola. The company has a successful i.MX ARM MPU line that has been shipping in smartphones, infotainment, and eReaders. The ARM MCU has grown quickly. The ARM architecture has the highest growth rate among 32-bit MCUs. There are about 10 ARM licensees shipping MCU versions. In total, ARM represents about one-quarter of the unit volume of 32-bit MCUs.

Freescale has been a long time leader in 32-bit MCUs. The company has a long history with ARM. Freescale began looking at such a product about 2 years ago. The product definition started almost a year ago.

Freescale has a strong reputation for its customer support, application knowledge and development tools, including software. An ARM-based MCU allows Freescale customers to tap into a large third party ecosystem.

Will Kinetis freeze out ColdFire?

At the same time as the Kinetis announcement, ColdFire+ was announced. This MCU is an extension of the current product line. ColdFire in turn is an extension of the venerable 68K architecture.

The question was raised immediately if Kinetis signals an end to ColdFire. Freescale would not put resources into ColdFire+ if this were the case. Both Coldfire+ and Kinetis will be manufactured on a new 90nm process. There will be more than 40 new versions of ColdFire+ rolling out – samples in 4Q 2010, production 1H 2011.

Freescale has a long history of supporting product families for decades. Customers have made major investments in designs based on ColdFire, most notably software. There are applications better suited to ARM than ColdFire. The product lines offer different price and performance choices. Thus, ColdFire will likely be around for a very long time.

Kinetis opens up new opportunities for Freescale. The company has joined a fast growing segment of the 32-bit MCU market.

Tony Massimini
Chief of Technology
tonym@semico.com


June 29th, 2010 | Posted in General by Tony Massimini| - No Comments »

Lots of Hoopla for Video Game Consoles, but what about the CPUs?

June 21, 2010

There was a lot of excitement last week at the E3 Show in Los Angeles.  There were numerous announcements, demos and news on new game titles.  On the hardware side what grabbed a good deal of attention were Sony and Microsoft products for motion control to compete with Nintendo Wii.

The console makers were also touting sleek new console designs.  These are slimmer and operate with less noise and lower power consumption, thus generating less heat.  Prices for consoles have come down over the years.  Ironically, the snazzy new peripherals will help make up the difference in price.

However, all of these appear to be about further enhancements and peripheral developments that improve the gaming experience of the current platforms.  3D games will be achieved through SW.  The console makers have taken advantage of improved semiconductor manufacturing technology to reduce the size and power consumption of the CPUs and GPUs.  This has enabled designs that are less expensive, lower power consumption and sleeker designs.

However, the basic design of the CPUs, GPUs and support chips have not changed since their introduction in late 2005 and 2006.  There is no discussion about next generation platform designs, similar to those that preceded the introduction of the current generation.

In 2005 I attended the E3 Show. A panel featured representatives from each of the console makers, IBM and Electronic Arts. The three different CPUs for the consoles are all different versions based on the PowerPC core designed by IBM. The speaker from EA, an executive VP,  made a very important point. The game developers are always under the gun to complete games, usually in time to launch for the holiday season. Consequently, he admitted, the first versions of a game title are not written very efficiently. The game developers need ever improving design tools. This was most notable at the time since new CPUs and GPUs were being released for the game consoles.

The executive VP of EA went on to say that over time the tools improve and the developers become more familiar with the CPUs and GPUs and learn how to squeeze more performance out of the platform.  This is why a popular title such as “Madden Football” offers more performance each year even though it runs on the exact same hardware.  However, eventually there is only so much performance that improved SW design can achieve.  This is about a five year cycle, hence the need for the next generation platforms that were being demoed in 2005.

We are now approaching the end of this five year cycle.  Yet there have been no discussion, rumors or whispers about new CPUs and/or GPUs.  Could these designs be in the works, but it is all hush-hush still?  Possibly, but if it takes 12 to 18 months or longer to develop a game title, there would be developers with simulators and technical specs for the new platforms.  How likely is it that not one of these developers would leak some news by now?  We know how ravenous gaming geeks can be for information in the blogo-sphere.

Keep in mind, when there is news of new CPUs and GPUs for video game consoles, it is actually the same designs being manufactured at a smaller process node.  The current designs were launched at the 90nm process node in 2005.  The progression to 65nm and now 45nm has followed the technology roadmap at the pace Semico had been expecting.  The video game console makers utilize this manufacturing evolution to reduce the die size, thus improving yields and lowering the cost.  The smaller design geometries enable lower voltages and thus lower power consumption.  Smaller heat sinks and smaller power supplies can be used.  Packaging costs can be reduced.  The soon to be released new Xbox 360 design has a multi-chip package for both the CPU and GPU which have moved to the 45nm node.

In the PC market, Intel and AMD take advantage of this manufacturing evolution by adding more transistors to increase performance and maintain, more or less, the same die size and stay within an acceptable power consumption envelope.  The PC industry will ship 350 million units this year, an order of magnitude higher than video game consoles.  If video game consoles were to follow the PC on this performance road map, there would be a large installed base of video game customers who would not be able use the most current game titles.  The long term profit for video games is to sell new titles to a growing customer base.

It seems to me that further game development, adding peripherals with more capabilities and increasing connectivity will put a strain on the current platform design.  Will these designs eventually hit the wall?  How long before we hear about next generation designs?  Will the industry stay with the Power Architecture?
Tony Massimini
Chief of Technology
tonym@semico.com


June 25th, 2010 | Posted in General by Tony Massimini| - No Comments »

Synopsys to Acquire Virage Logic

On Thursday, the 10th of June, Synopsys announced its intention to acquire Virage Logic for $315M ($289M after accounting for cash in Virage’s possession). The acquisition is expected to close around late October of this year.

This transaction will provide Synopsys with many diverse types of SIP such as Memory cells (both volatile and non volatile), Memory compilers, Memory controllers, Interface I/Os, the ARC CPU cores along with Audio and Video IP blocks, some limited ‘Mega-Blocks (SIP that merges the ARC CPU cores with Audio / Video IP), basic Interconnect SIP, some basic Analog and Mixed Signal functionality, Standard Cell libraries, Communications IP, and a host of basic logic functions. In essence, Synopsys will now possess most of the elements needed to create their own SIP Sub Systems as complete products to be offered to the market at large. While Synopsys has not signaled their intent to create such SIP Sub Systems directly, they have hinted this is the direction in which they will go and it is a logical step for them to do so. Bringing more value to their customers – through offering better performing, more highly converged products as SIP Sub Systems, will ultimately bring more value to Synopsys.

This acquisition comes on the heels of the Cadence acquisition of Denali which came after the initial publishing of the Cadence EDA360 white paper. It would seem that Synopsys felt the need to counter the Cadence move with one of their own, but is it really that simple?

All of the above is pretty straightforward in itself, but what are the real implications for the SoC market, the SIP market and the EDA market going forward? The following ideas will try to put these events in perspective.

Without a doubt, the landscape in the three markets mentioned above is changing driven by the increasing cost of SoC design, rising SoC complexity and the escalating cost and importance of applications software to run on the SoC once it is done. An inability to manage all these elements successfully calls into question whether or not the company producing the SoC will enjoy the right level of profitability on the silicon to make the effort worthwhile in the first place. Conversely, an ability to manage all these elements of the design process would give a company possessing them a decided leg up in the marketplace. Based on the tenets put forth in the EDA360 white paper, and the recent actions by Cadence and Synopsys, the industry is moving in the direction of putting in place changes to the SoC design methodology that solve, or at least mitigate, some of these issues. This will be done by offering more highly integrated solutions that increase the performance of the end silicon and that offer a way to manage the convergence of the  functions required in contemporary system design today.

Because at the end of the day it is no longer so much all about the silicon itself, or even about the process people take to design the silicon. It is about approaching the entire process of creating the silicon in such a way that the final system implementation is made better, easier, higher-performing and more cost effective.

One can also interpret these events from a different direction.

There are over 400 SIP companies in the market today, half of which have revenues of less that $1M. Many of them are good companies with good products, but are limited in scope due to their small size. With the recent acquisitions of Denali and Virage, the wave of consolidation that has been predicted for the last several years would seem to be underway and that these are only the opening moves in that process. However, one can look at this in another way.

An alternative view instead could be that the days of being a SIP vendor with ‘me-too’ products is coming to a close. The market can no longer reward products that do not bring value through innovation to it. Just by having SIP the success of a company is no longer guaranteed, as it was ten years ago when the market was buzzing about that very exotic animal: 3rd Party Semiconductor Intellectual Property. In today’s market environment, not only must the SIP products be of high quality and performance, they must also integrate more functions that had previously been individual discrete blocks and they must provide value to the customer. In a word, they must be innovative.

The words, “Necessity is the mother of invention”, have never been truer than in today’s environment.

Semico believes that, given the right prompting by the market, we could see a push towards products that lend themselves to architecting better system solutions instead of only addressing the implementation of better silicon solutions. While no one would argue that better silicon solutions are not desirable, they do not solve all the problems facing systems’ companies today. How does one get a handle on the massive software development efforts required to pump out the next killer Smart Phone or Netbook? How does one extend the battery life of a product that has an increasing silicon content in it to provide the new features and functions consumers want?

One way to do this is to create products that offer solutions to the issues facing designers outlined above that either directly address the system integration issues these questions pose or to create an ecosystem and environment that lends itself directly to enabling the SoC designer to solve these issues him / herself.

SIP Sub Systems, if architected the right way, can provide some of the solution. A comprehensive design environment that includes methods to address SIP integration, applications software creation tuned to the SIP Sub System and the SoC silicon and method of tying testbenches and verification information to the SIP Sub Systems as a complete, deliverable all-in-one package can empower the final system solution.

Semico believes that the recent moves by Cadence and Synopsys are merely steps along this path and that new EDA-flavored products that include in-depth management of the SIP integration and applications software creation functions are on the horizon.

However, just like no one has a corner on the market for good ideas, no one company will be able to produce all the system level solutions needed to enable the next ‘gotta-have’ consumer product. It will take a concerted effort by many companies at many levels to create the right products to do this.

As far as the 3rd Party SIP market is concerned, Semico believes this creates a place at the table for smaller companies that have innovative products and solutions to continue to participate in the market going forward. There will continue to be consolidation, but there will also be new companies emerging around these innovate solutions to take the place of those who are acquired or who exit the market altogether. This should be viewed as a process and not as an endgame. This is especially true in light of the looming wholesale deployment of nanotechnology and meta materials into the semiconductor design and manufacturing flow. These will be disruptive technologies that will create even more opportunities for innovative companies and products.

One thing is certain:

DAC 2010 is going to be very interesting this year!


June 14th, 2010 | Posted in General by Rich Wawrzyniak| - 1 Comment »

Investing For The Next Downturn?

Although the semiconductor industry cycles are difficult to predict, one thing always rings true, over-investment creates over-capacity, lower prices and usually sluggish or declining semiconductor revenues.

The stage is being set. Two weeks ago, Samsung announced its biggest ever semiconductor capital expenditure budget, some say the biggest the industry has ever experienced from one company. A majority of the approximately $10 billion total of Samsung’s 2010 semiconductor spending will be on capacity expansion for memory products.

This week, GLOBALFOUNDRIES, backed by its major shareholder ATIC, announced an additional $3 billion dollars in capital expansion projects, on top of the $6 billion already announced. Other companies have also announced larger capex projections for 2010.  Total industry capital investment in 2010 could exceed total investments made in 2000. 

During the past three years the industry has curtailed capital expenditures, which Semico believes helped to dampen the effects of the last downturn. But are we now walking into the same trap?

One could argue that the capex is more highly concentrated to fewer players. One could also say that advanced technology production is more expensive these days. However, these capacity additions are expected to come online right during the next slowdown that Semico has predicted. Coincidence?

Joanne Itow
Managing Director


June 1st, 2010 | Posted in General by Joanne Itow| - 1 Comment »

Google TV: what does it mean for processors?

May 25, 2010

The world of TV is changing rapidly. The recent Semico Spin article by my colleague, Michell Prunty, presents the scenario that is playing out. The entire business model for TV is changing. Over a year ago cable TV companies were reporting that their cable subscriptions were dropping, but their internet business was growing. Clearly, people like Michell were contributing to this trend.

Over the course of the last decade there has been strong growth for TV set-top boxes as well as variations, such as IP-TV and satellite TV. Concurrent with this has been the transition to digital TV and HDTV. Consumer electronics companies are now working on 3DTV. But the new business model presented by Google TV has technical implications as well.

Google’s Android is open source. In terms of a processor it is considered architecture-neutral. It should be noted that the architecture with the dominant market share in DTV, TV STB, etc. is MIPS. The company has worked closely with Google to develop and support a software ecosystem for Android on MIPS-based solutions.

The digital home market is an important market for MIPS. It will work hard to maintain its dominant position. Since Android is processor agnostic there will be increased competition from ARM, Power PC and Intel’s Atom. The new platforms will have to deliver the performance and independence that consumers are looking for.

Tony Massimini
Chief of Technology
tonym@semico.com


May 25th, 2010 | Posted in General by Tony Massimini| - 1 Comment »